Epoxy Systems

An extensive line of one and two component epoxy adhesives, sealants, coatings, potting/encapsulation compounds and impregnation resins are available for use. Two part systems can be cured at room temperature or at elevated temperatures. One part systems can be cured at elevated temperatures only (typically 250-300F).

Master Bond epoxy compounds are designed to withstand exposure to hostile environmental conditions. They are employed in aerospace, automotive, optical, medical, oil/chemical processing, electronics and other industries. Master Bond products can be formulated to meet specific application requirements.

Epoxy Features Very Low Coefficient of Thermal Expansion

Toughened Two Part Epoxy Withstands Repeated Thermal Cycling

One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability

Versatile Epoxy Compounds for Electronic Applications

Epoxy Innovations Drive Adhesive Bonding Growth

Epoxy Features Very Low Coefficient of Thermal Expansion

Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or…

Conductive Epoxy Replaces Lead Soldering

Checklist of Questions To Consider When Using an Adhesive

Epoxies Safeguard Medical Electronic Devices