mical co

UL 94V-0Grade(Insulation Potting, Casting, Encapsulating)

1-Part (IC Encapsulating, Adhesive, Confidential series)

Rigid (Electronics, Electrics, Insulation, Potting, Casting, Encapsulating, Thermal Conductive, Adhesive)

Epoxy Resins Series (Constructions, Coatings)

Mild-soft, excellent impact strength.

high voltage resistance, high temperature resistance up to 150, good thermal conductivity 0.5 W/mk

Mid-high temperature curing schedule, high voltage resistance.

Can be cured at lower temperature (80~100), adhesive for electronic parts assembling.

Fast cure, short-term high temperature resistance (280), SMT, screen printable.

Can be cured at lower temperature (80~100), leveling, IC sealing, adhesive for electronic parts assembling.

Mid-high temperature curing schedule, excellent adhesive properties, for IC encapsulation and electronic part adhesion.

Mid-high temperature curing schedule, excellent adhesive properties, for IC encapsulation and electronic part adhesion.

Good weather resistance, high tensile strength, for potting, casting.

Excellent dielectric properties, high voltage resistance, for large electric component potting.

Non-sag, easy to operate, for large electric component adhesive and dipping.

Excellent weather resistance, high gloss, for electric component potting and thin layer coating, and binding.

Excellent weather resistance, high thermal conductivity, for insulation and potting of where weather resistance is required.

Long pot life, for electric component sealing, potting, casting.

High tensile strength, low viscosity, for insulating, potting, casting, general purpose.

Easy to use, excellent dielectric properties, thermal resistance, for electronic and electric insulation, potting, and casting.

asy to use, low viscosity, general purpose.

Room temperature cure, high temperature resistance when heating cure.

Mid-viscosity, high temperature resistance, high thermal conductive, heat cure, for large electric component potting.

High viscosity, heat cure type with thermal resistance, high thermal conductivity, for high voltage ignition coil of automobile vehicles.

Mid viscosity, high voltage resistance, high thermal conductive, low temperature resistance, for high voltage ignition coil of automobile vehicles, CDI, rectifier regulator.

Thermal conductive adhesive, 0.8 W/mk.

High transparency, long pot life, no heat generation.

Easy to use, low viscosity, good elasticity, for potting and insulation of delicate circuit of electronic components.

Low viscosity with high tensile strength, elastic, low stress, for casting of delicate circuit of electronic components.

High flexibility, potting material for electronic and electric components.

High strength, potting material for automobile vehicles and electronic components.

Good weather resistance especially for low temperature, good flexibility, room temperature cure, good dielectric properties for potting of electronic components.

Easy to use, good impact strength, low temperature resistance, for insulating and potting of electrical and electronic components.

Soft, low temperature stable (-30oC), for potting and insulation of delicate circuit of electronic components.

High transmittance, excellent thermal resistance, for casting of light-emitting diode and small LED.

High transmittance, excellent thermal resistance, for casting of light-emitting diode and small LED.

High transmittance, excellent thermal resistance, for casting of light-emitting diode.

Insulation material, for insulator coil, insulator paper, and insulator cloth.

High transparency, for LED encapsulation.

Low viscosity, high transparency, for metals coating.

Cold (imitated) enamel coating, low viscosity.

Cold (imitated) enamel coating, low viscosity, for cold weather.

Mid viscosity, excellent adhesive properties to metals and plastics.

Cold enamel coating, low viscosity, long pot life.

Low viscosity, long pot life, good leveling.

Mild, easy to use, for printings or large surface coating.

Excellent transparency, mild, excellent weather resistance.

Excellent transparency, replacing lacquer, for UV cure printing.

High viscosity, screen printable,, UV cure.

General use, for high height doming.

High mechanical strength, mid-high viscosity, for repairing, filling of constructions.

General use, for resin slurries, bumped roadways.

Non-sag, fast cure, high performance construction use adhesive, for glisten signs.

Clear spray, for ceramics and metals coating.

Dust-free floor, general use for metals and hardware coating.

Non-sag, excellent adhesive properties.

Low viscosity, fast cure, for wall reinforcement.

Floor coating and wall coating for leakproof.

216-22 2F. No.216-2, Zhongzheng Rd., Shulin Dist., New Taipei City 238, Taiwan (R.O.C.)

TEL : 886-2-2682-4939 FAX : 886-2-2683-4333